Simple solutions to high-speed design challenges.
Reduce manual routing time for even the most complex projects.
Reduce noise and improve signal timing, even on the most complex boards.
高密度互连(HDI)设计突破了走线、过孔和层密度的极限。这些板的层数很多,走线和过孔却极小。相比功能繁复的典型电路板,HDI PCB的制造和组装过程有所不同。浏览我们的资源库,了解有关HDI PCB设计实施的更多信息。